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Robustness of mutual information to inter-subject variability for automatic artefact removal from EEG

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Nicolaou, N. and Nasuto, S. J. orcid id iconORCID: https://orcid.org/0000-0001-9414-9049 (2005) Robustness of mutual information to inter-subject variability for automatic artefact removal from EEG. In: 2005 27th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Vols 1-7. Proceedings of Annual International Conference of the Ieee Engineering in Medicine and Biology Society. IEEE, New York, pp. 5991-5994. ISBN 0780387406

Abstract/Summary

The externally recorded electroencephalogram (EEG) is contaminated with signals that do not originate from the brain, collectively known as artefacts. Thus, EEG signals must be cleaned prior to any further analysis. In particular, if the EEG is to be used in online applications such as Brain-Computer Interfaces (BCIs) the removal of artefacts must be performed in an automatic manner. This paper investigates the robustness of Mutual Information based features to inter-subject variability for use in an automatic artefact removal system. The system is based on the separation of EEG recordings into independent components using a temporal ICA method, RADICAL, and the utilisation of a Support Vector Machine for classification of the components into EEG and artefact signals. High accuracy and robustness to inter-subject variability is achieved.

Additional Information Proceedings Paper 27th Annual International Conference of the IEEE-Engineering-in-Medicine-and-Biology-Society AUG 31-SEP 03, 2005 Shanghai, PEOPLES R CHINA
Item Type Book or Report Section
URI https://reading-clone.eprints-hosting.org/id/eprint/14439
Item Type Book or Report Section
Divisions Life Sciences > School of Biological Sciences > Department of Bio-Engineering
Uncontrolled Keywords automatic artefact removal, EEG, temporal ICA, TDSEP, RADICAL, SVM
Additional Information Proceedings Paper 27th Annual International Conference of the IEEE-Engineering-in-Medicine-and-Biology-Society AUG 31-SEP 03, 2005 Shanghai, PEOPLES R CHINA
Publisher IEEE
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